Tag archives: ultrasonic soldering
Published: Oct. 13, 2014
Tags: high-pressure oxygen sputtering / indium / oxide electronics / sputter targets / ultrasonic soldering
Ceramic sputter targets often need to be bonded to a metallic carrier. The better this bond provides mechanical, electrical and thermal contact, the better and longer the target works. This article describes indium soldering, the method that worked best during my PhD work where I used high-pressure oxygen sputtering extensively. The text is partly adapted from my PhD thesis.
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